Project status report as of end of 2011. Key milestones and accomplishments in the year 2011 include: Proof of feasibility of analog and digital components with their lifetime tested for more than 500 hours at 300 degrees C, Demonstration of ceramic-based packaging capable of surviving 300 degrees C, Demonstration of a temperature sensor system, Completion of the design of a pressure sensor system, and Demonstration of a prototype of the digital telemetry system.